THERMALLY STABLE WTIAU NONALLOYED OHMIC CONTACTS ON IN0.5GA0.5AS FOR GAAS-ALGAAS HETEROJUNCTION BIPOLAR-TRANSISTOR APPLICATIONS

Citation
Kg. Merkel et al., THERMALLY STABLE WTIAU NONALLOYED OHMIC CONTACTS ON IN0.5GA0.5AS FOR GAAS-ALGAAS HETEROJUNCTION BIPOLAR-TRANSISTOR APPLICATIONS, Materials science & engineering. B, Solid-state materials for advanced technology, 25(2-3), 1994, pp. 175-178
Citations number
13
Categorie Soggetti
Material Science","Physics, Condensed Matter
ISSN journal
09215107
Volume
25
Issue
2-3
Year of publication
1994
Pages
175 - 178
Database
ISI
SICI code
0921-5107(1994)25:2-3<175:TSWNOC>2.0.ZU;2-H
Abstract
This paper demonstrates WTiAu as a thermally stable, low resistance, n on-alloyed, emitter ohmic contact for GaAs-AlGaAs heterojunction bipol ar transistor applications. The minimum W layer thickness required for low contact resistance and long-term thermal stability was obtained. A W layer 900 angstrom thick yielded the lowest contact resistance (R( c) = 0.045 OMEGA mm) with a high degree of uniformity after (1) a coll ector ohmic contact rapid thermal annealing cycle at 420-degrees-C and (2) 500 h at 250-degrees-C. Secondary ion mass spectroscopy results i ndicate that In outdiffusion contributes to the thermal instability wh en thinner W layers are used.