Dg. Lee et Oa. Palusinski, ADAPTATION OF SPICE3 TO SIMULATION OF LOSSY MULTIPLE-COUPLED TRANSMISSION-LINES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 126-133
Design of high-speed, high-proformance electronic circuits requires si
mulation of transients in networks that include multiple, coupled loss
y transmission lines. A widely used circuit simulator, SPICE, does not
have facilities for simulation of multiconductor, transmission lines.
Recently a modification to SPICE3 to include multi-conductor lossless
lines was reported. In many situations line losses must be included i
n the model and networks with lossy transmission simulated. In general
simulation of lossy transmission lines is complex and computationally
very intensive. The situation is simpler when D-C losses are consider
ed. A recent study concluded that D-C losses provide an adequate model
ing of signal transmission in many practical situations. This paper de
scribes the implementation of multi-conductor, coupled lines with D-C
losses in SPICE3e2. This implementation ties SPICE transient analysis
with a special algorithm for the analysis of a transmission line and i
s more efficient than another approach based on the concept of a trans
mission line subcircuit. Internal tests of the new program, LSPICE3, w
ere successfully performed and now this program is available to SPICE3
users.