SPICE SIMULATION OF LOSSY AND COUPLED INTERCONNECTION LINES

A new simulation method for analyzing propagation characteristics of h igh frequency waves on single or coupled lossy interconnections is pre sented, based on the universal CAD SPICE software. The concept used is the direct analysis of lossy propagating lines as an equivalent circu it which can be easily modeled and simulated by SPICE software. The re sults obtained in both frequency and time domains agree well with othe r published methods. The applications to advanced packaging technology , especially for fast IC logic gates and superconductor materials, are promising and offer considerable potential.