DELAY MACROMODELS FOR POINT-TO-POINT MCM INTERCONNECTIONS

Citation
Ai. Kayssi et Ka. Sakallah, DELAY MACROMODELS FOR POINT-TO-POINT MCM INTERCONNECTIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 147-152
Citations number
8
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709894
Volume
17
Issue
2
Year of publication
1994
Pages
147 - 152
Database
ISI
SICI code
1070-9894(1994)17:2<147:DMFPMI>2.0.ZU;2-Z
Abstract
We develop delay macromodels for lossless as well as lossy point-to-po int MCM transmission lines using a systematic model construction proce dure that includes dimensional analysis. The result for lossless lines confirms earlier work and extends it to the case of nonlinear drivers and capacitive termination. For lossy lines, we show that dimensional analysis allows us to reduce the complexity of the delay expression w ithout any loss in accuracy. A second-order polynomial fit to a four-a rgument delay function is shown to yield predictions that are within 5 % of detailed circuit simulation at a fraction of the computational co st. We illustrate the applications of these macromodels in studying th e effects of packaging technology on signal delay and in sensitivity a nalysis.