Ai. Kayssi et Ka. Sakallah, DELAY MACROMODELS FOR POINT-TO-POINT MCM INTERCONNECTIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 147-152
We develop delay macromodels for lossless as well as lossy point-to-po
int MCM transmission lines using a systematic model construction proce
dure that includes dimensional analysis. The result for lossless lines
confirms earlier work and extends it to the case of nonlinear drivers
and capacitive termination. For lossy lines, we show that dimensional
analysis allows us to reduce the complexity of the delay expression w
ithout any loss in accuracy. A second-order polynomial fit to a four-a
rgument delay function is shown to yield predictions that are within 5
% of detailed circuit simulation at a fraction of the computational co
st. We illustrate the applications of these macromodels in studying th
e effects of packaging technology on signal delay and in sensitivity a
nalysis.