PACKAGE INDUCTANCE CHARACTERIZATION AT HIGH-FREQUENCIES

This paper describes a package inductance measurement technique based on network analysis and lumped element package model. Advantages of th is technique include: 1. Measuring inductance over the same high opera ting frequencies of today's high-speed CMOS and ECL chips, 2. Providin g information on a package's resonance frequencies and determining the limit of the lumped element model, and 3. Utilizing a simple one-port measurement method, procedure and fixture design. Different packages and interconnects including a 120QFP, a 296TAB tape, a multilayer 224P GA and bonding wires of different length were characterized using this technique. Where possible, the inductance results obtained by this te chnique were compared with both modeling data and measurement data obt ained by the conventional LCZ technique. In addition, the experiments were extended to compare the effective inductance of the ground path o f one-metal and two-metal 360TAB tapes. The results provide important guidelines in determining design tradeoffs between one-metal and two-m etal TAB tapes.