A METHOD TO PREDICT CRACKING IN IC PLASTIC PACKAGES

Authors
MARGARITIS G MCGARRY FJ
Citation
G. Margaritis et Fj. Mcgarry, A METHOD TO PREDICT CRACKING IN IC PLASTIC PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 209-216
Citations number
20
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging → ACNP
ISSN journal
10709894
Volume
17
Issue
2
Year of publication
1994
Pages
209 - 216
Database
ISI
SICI code
1070-9894(1994)17:2<209:AMTPCI>2.0.ZU;2-6
Abstract
We present a method to predict cracking in a model geometry, represent ing an IC plastic package, under monotonic thermal loading, when no de laminations are present. The results of the analysis are expressed in a dimensionless form so they are generally applicable. A critical rela tion between the residual stress in the polymer and its tensile streng th predicts fracture. Experimental results with a commercial encapsula nt show good agreement with the analysis.