DESIGN OF LOW DIELECTRIC GLASS+CERAMICS FOR MULTILAYER CERAMIC SUBSTRATE

Compositional design and properties of a low dielectric constant glass +ceramics, containing borosilicate glass, high silica glass and alumin a, for multilayer ceramic substrates are described. The new low, diele ctric system can be densified at below 1000-degrees-C in air, allowing high electrical conductivity metallization including Au and Ag-Pd. Co mpositions with tailor-made properties are designed according to a wor king model based upon mixing rule, and validated with experimental res ults. Compositions with a thermal expansion coefficient compatible wit h Si and GaAs, and a dielectric constant in the range of 4-4.5 and 5-6 , respectively, are developed.