CHARACTERIZATION OF APERTURE-COUPLED MICROSTRIP PATCH ANTENNA WITH THICK GROUND PLANE

The feasibility of using a thick ground plane with an aperture coupled microstrip patch antenna while maintaining reasonable antenna perform ance is demonstrated using moment method and reciprocity analyses in t he spectral domain. The thick ground plane, which may serve as a heats ink for active MMIC circuitry, or as a mechanical support for thin sub strates, is particularly advantageous in millimetre wave phased army a pplications. It is found that the effect of ground plane thickness is to reduce the level of coupling from the feed line to the patch.