In a uhv system, with a base pressure below 10(-10) mbar Cu films on c
-cut sapphire (Al2O3) have been grown by e-gun evaporation. The films
were characterized by X-ray diffraction, in situ RHEED, SEM and Talyst
ep profilometer. Pole figures taken with a diffractometer show sharp p
eaks in the phi-plane, revealing epitaxy. The halfwidths in phi and ch
i depend strongly on the polishing method by which the substrates have
been prepared and on the substrate temperature during evaporation. Wi
th Aerosil polished substrates the epitaxy temperature is as low as 12
0-degrees-C and even at room temperature moderate epitaxy can be achie
ved. Diamond polished substrates show epitaxy only for T(S) > 200-degr
ees-C.