A HIGH-DENSITY, 4-CHANNEL, OEIC TRANSCEIVER MODULE UTILIZING PLANAR-PROCESSED OPTICAL WAVE-GUIDES AND FLIP-CHIP, SOLDER-BUMP TECHNOLOGY

An optoelectronic transceiver module is described consisting of a four -channel AlGaAs integrated laser/monitor transmitter and a four-channe l GaAs MESFET integrated detector/preamp receiver. The optoelectronic chips are flip-chip, solder-bump bonded to a substrate containing elec trical wiring and planar-processed optical waveguides. The optical wav eguide layer serves two purposes: the routing of optical signals, as w ell providing mechanical registrations for the optoelectronic chips an d fiber-optic ribbon connector. The work described here demonstrates o ne approach to high-density, optoelectronic array packaging compatible with existing high-performance electronic packaging technology.