K. Wurm et al., EVOLUTION OF SURFACE-MORPHOLOGY OF SI(100)-(2X1) DURING OXYGEN-ADSORPTION AT ELEVATED-TEMPERATURES, Physical review. B, Condensed matter, 50(3), 1994, pp. 1567-1574
We used scanning tunneling microscopy and low-energy electron microsco
py to study the etching of the Si(100)-(2 X 1) surface by oxygen at lo
w pressures and elevated temperatures. At 5 X 10(-8) torr partial pres
sure of oxygen, the transition from random etching of terraces to step
etching occurs at approximately 580-degrees-C, while at the higher pa
rtial pressure of 5 X 10(-7) torr, the transition temperature is appro
ximately 625-degrees-C. The diffusing species is a dimer vacancy, form
ed by the desorption of two SiO molecules. Anisotropic diffusion of th
e vacancies is observed, with a preferred direction along the dimer ro
ws. The reaction probability, defined as the number of desorbed SiO mo
lecules to the number of incident 02 molecules, is estimated to be 0.0
10+/-0.005.