MULTIPLE-LAYER OPTICAL INTERCONNECTIONS USING THROUGH-WAFER HOLLOW-DIELECTRIC-WAVE-GUIDE VIAS

We investigate lossy hollow-dielectric-waveguide vias in a dense optic al interconnection system as a means by which many 2-D processor layer s can communicate simultaneously with minimal signal attenuation. Via- guided multiple-layer signal attenuation and design guidelines are der ived for both GaAs and Si substrate materials, and are compared to tho se for unguided interconnections at 0.85 mum and 1.3 mum. We find that optical interconnections using hollow-dielectric-waveguide vias can s upport dense low-loss interconnections at 0.85 mum, whereas propagatio n through the substrate is preferred at 1.3 mum.