ON THE FAILURE-MECHANISM OF ANISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS ON COPPER METALLIZATION

Authors
LIU J
Citation
J. Liu, ON THE FAILURE-MECHANISM OF ANISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS ON COPPER METALLIZATION, International journal of adhesion and adhesives, 16(4), 1996, pp. 285-287
Citations number
7
Categorie Soggetti
Material Science
Journal title
International journal of adhesion and adhesives → ACNP
ISSN journal
01437496
Volume
16
Issue
4
Year of publication
1996
Pages
285 - 287
Database
ISI
SICI code
0143-7496(1996)16:4<285:OTFOAC>2.0.ZU;2-I
Abstract
In this paper, a theoretical model for degradation of anisotropically conductive adhesive (ACA) joints has been developed. The model takes i nto account oxide growth of bonding surfaces and interfacial crack gro wth. The calculations based on the model show that oxidation causes in crease in the electrical resistance but does not cause catastrophic fa ilure. The model can to some extent explain the experimental results.