Silicon micromachining has successfully been applied to fabricate piez
oelectric, piezoresistive and capacitive microphones. The use of silic
on has allowed the fabrication of microphones with integrated electron
ic circuitry and the development of the new FET microphone. The introd
uction of lithographic techniques has resulted in microphones with ver
y small (1 mm2) diaphragms and with specially shaped backplates. The a
pplication of corrugated diaphragms seems a promising future developme
nt for silicon microphones. It is concluded from a noise consideration
that the FET microphone shows a high noise level, which is mainly due
to the small sensor capacitance. From this noise consideration, it ca
n be shown that integration of a capacitive microphone and a preamplif
ier will result in a further reduction of the noise.