DEPOSITION BY PULSED EROSION OF NICKEL AND ALUMINUM ON COPPER

In order to produce highly adherent coatings, various techniques are a vailable, each of them presenting favourable and negative aspects. In this paper we present the novel method of deposition by pulsed erosion for obtaining relatively thick layers on different substrates. In par ticular we examine here coatings of Ni or Al on copper substrates. Hig h intensity pulsed ion beams were generated in a rod plasma injector m achine, equipped with coaxial-grid-type electrodes. Several pulses of plasma containing ions of the discharge gas argon and eroded Ni (Al) m aterial were used to irradiate separately the substrates. The energy d ensity of pulses was in the range 4-6 J cm-2, with an ion mean kinetic energy of the order of 10 keV, The samples were analysed by scanning electron microscopy, X-ray diffractometry and secondary-neutral mass s pectrometry.