The effect of electrical deactivation of arsenic in silicon has been s
tudied. High concentrations of arsenic were implanted and laser melt a
nnealed, creating boxlike fully electrically active arsenic layers, wi
th no residual implant damage. Wafers were then subjected to low tempe
rature thermal cycles while a buried boron layer monitored point defec
ts. Strong enhancements in the boron diffusion were observed suggestin
g that arsenic deactivation releases large numbers of interstitials. T
his is explained by a process where the vacancies required by the deac
tivated arsenic structures are created through a deactivation assisted
Frenkel pair generation process, thus injecting interstitials.