The radial distribution of grown-in microdefects in eight Czochralski-
grown silicon crystals was measured by counting the how pattern (FP) d
efects revealed by preferential etching. At the center of the crystal,
the FP-defect density increased from 5.2 to 6.7 x 10(5) l/cm(3), when
the pulling speed was increased from 0.8 to 1.1 mm/min. The magnitude
of this effect was only about half as large, when the pulling speed w
as increased from 1.1 to 1.3 mm/min. Annealing at 1200 degrees C for 2
h in argon ambient was found to decrease the FP-defect densities sign
ificantly, but less than that in oxygen ambient.