CAPACITANCE CALCULATION OF IC PACKAGES USING THE FINITE-ELEMENT METHOD AND PLANES OF SYMMETRY

Authors
CHOU TY CENDES ZJ
Citation
Ty. Chou et Zj. Cendes, CAPACITANCE CALCULATION OF IC PACKAGES USING THE FINITE-ELEMENT METHOD AND PLANES OF SYMMETRY, IEEE transactions on computer-aided design of integrated circuits and systems, 13(9), 1994, pp. 1159-1166
Citations number
8
Categorie Soggetti
Computer Application, Chemistry & Engineering","Computer Science Hardware & Architecture
Journal title
IEEE transactions on computer-aided design of integrated circuits and systems → ACNP
ISSN journal
02780070
Volume
13
Issue
9
Year of publication
1994
Pages
1159 - 1166
Database
ISI
SICI code
0278-0070(1994)13:9<1159:CCOIPU>2.0.ZU;2-9
Abstract
Finite element techniques are presented for determining the capacitanc e of three-dimensional interconnection structures. Results are present ed for two typical intergrated circuits packages: the plastic leaded c hip carrier (PLCC) and the dual in-line package (DIP). The symmetry of the capacitance matrix in the package is described and a set of formu las is presented to take advantage of this symmetry in capacitance cal culation. This leads to the reduction in cpu time and memory usage and better converged solution.