Yc. Shih et al., EPITAXIAL LATERAL OVERGROWTH OF SILICON BY CHEMICAL-VAPOR-DEPOSITION ON ULTRATHIN OXIDE LAYERS, Applied physics letters, 65(9), 1994, pp. 1142-1144
Selective epitaxial growth followed by epitaxial lateral overgrowth (E
LO) of silicon through windows in SiO2 in a hot-wall low-pressure chem
ical vapor deposition system has been used to fabricate silicon-on-ins
ulator (SOI) structures. By careful ex situ and in situ surface cleani
ng and low-temperature processing, 2.5-mum-thick single-crystal silico
n films have been successfully deposited over oxide layers as thin as
35 angstrom. Dislocation densities in these SOI films over thin oxides
are higher than those found in SOI films deposited on thicker oxides.
Nucleation of dislocations in the epitaxially grown film is attribute
d to pinhole expansion in the ultrathin oxide layers during ex situ cl
eaning, prebake treatment, or ELO processing. An unusual crystallograp
hic defect with attributes of a microtwin-stacking fault complex are a
lso observed in the ELO film appearing over thin oxide layers. A model
is proposed to explain this class of defect structure and its formati
on mechanism.