Defect structure and electrical characterization of boron and arsenic
implanted layers has been investigated for implantation under athermal
(light) excitation. This Photon Assisted (PA) implantation owes its s
pecific properties to an additional electric field acting on charged p
articles including carriers and charged defects. It was shown that in
case of n-type silicon this extra held draws charged vacancies and sel
f-interstitials towards each other and, thus, diminishes transient dif
fusion of boron. This effect resulted in junctions which are about 20%
shallower compared to conventionally processed reference wafers. Expe
riments using light of an Ar-ion laser and white light of a high press
ure Xe are lamp were compared. Some deactivation of carriers in the de
eper laying parts of the p-region was always a by-product.