Wf. Chissoe et al., MOUNTING POLLEN ON A THERMOPLASTIC ADHESIVE FOR SCANNING ELECTRON-MICROSCOPY, Transactions of the American Microscopical Society, 113(1), 1994, pp. 72-79
A heat-sensitive adhesive, Tempfix(R), developed for scanning electron
microscopy of powders and small particles, provides consistently high
-quality secondary imaging with a variety of pollen grain morphologies
and preparation protocols. Tempfix(R) was used successfully under all
combinations of these conditions: (1) pollen air-dried from ETOH or a
rtificially dried; (2) pollen transferred to naked or sputter-coated T
empfix(R); and (3) pollen transferred to solid (at room temperature) o
r tacky (40-43-degrees-C) Tempfix(R). In contrast to other adhesives,
Tempfix(R): (1) does not react with the dehydration fluid ethanol; (2)
permits control of depth of pollen penetration into the adhesive; (3)
provides a high pollen retention rate with both air-dried and artific
ially dried preparations; and (4) has a smooth glassy background.