A PHYSICAL MODEL TO PREDICT THE THERMOMECHANICAL BEHAVIOR OF HOT-MELTADHESIVES

The paper presents a model that allows one to calculate the linear vis coelastic behaviour (complex shear modulus as a function of frequency) and thermomechanical behaviour (complex shear modulus as a function o f temperature) of various formulations of hot-melt adhesives containin g a polymeric base, a tackifying resin and a crystalline wax. The mode l takes into account the nature and molecular weight distribution of t he polymer, the glass transition temperatures of the polymer and the r esin, and the crystallinity of the added wax. A computer program has b een derived from the model to simulate the thermomechanical behaviour of the formulations from their composition. It fits, with a reasonable accuracy, the experimental data. The model has been tested for two po lymeric bases (EVA and EBA) and two different tackifying resins.