Pj. Ding et al., INVESTIGATION OF THE MECHANISM RESPONSIBLE FOR THE CORROSION-RESISTANCE OF B IMPLANTED COPPER, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 85(1-4), 1994, pp. 260-263
Ion implantation is an effective way to passivate copper films. The pr
esent work was designed to refine our understanding of the mechanisms
which lead to this result. The oxidation of B implanted copper and cop
per oxide (Cu2O) was studied. It was found that the oxidation rate of
Cu2O implanted with B is as low as that of copper metal implanted with
B. Further, it is observed that CuO forms on the surface of both B im
planted Cu and Cu2O, in contrast to the Cu2O that forms on not implant
ed copper. A mechanism which leads to these effects is briefly discuss
ed.