ELECTRICAL STRESSING OF SUBMICROMETER MOSFETS WITH RAISED SOURCE DRAIN STRUCTURES REALIZED BY SELECTIVE EPITAXIAL-GROWTH OF SILICON USING SILANE ONLY/

Citation
A. Waite et al., ELECTRICAL STRESSING OF SUBMICROMETER MOSFETS WITH RAISED SOURCE DRAIN STRUCTURES REALIZED BY SELECTIVE EPITAXIAL-GROWTH OF SILICON USING SILANE ONLY/, Electronics Letters, 30(17), 1994, pp. 1455-1456
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
ISSN journal
00135194
Volume
30
Issue
17
Year of publication
1994
Pages
1455 - 1456
Database
ISI
SICI code
0013-5194(1994)30:17<1455:ESOSMW>2.0.ZU;2-J
Abstract
Submicrometre CMOS devices with raised source and drain (RSD) structur es, realised by selective epitaxial growth (SEG) of silicon in silane have been electrically stressed. These devices were less susceptible t o hot carrier degradation than their conventional counterparts, due to graded source and drain junctions.