MICROSTRUCTURE CHARACTERIZATION IN ELECTRODEPOSITED CU-COATINGS OBTAINED AT DIFFERENT BATH TEMPERATURES

X-ray profile and texture analysis, optical microscopy and microhardne ss measurement were used in order to study the dependence of the micro structure formation of electrodeposited copper coatings on the bath te mperature. The coatings were obtained from an acid electrolyte without any additions within a temperature range from -10 degrees C up to 110 degrees C on polycrystalline copper and amorphous carbon substrates. The obtained temperature dependence of dislocation density is similar to that of the microhardness. Above room temperature the lattice perfe ction and the main grain size rapidly increase. At all temperatures de position on carbon leads to a [110]-fibre texture, but on copper subst rates a texture change of the coatings from a [110]-fibre to a more co mplicated, substrate-related epitaxial texture was observed.