When metal/ceramic junctions are achieved by solid state bonding proce
ss, damages and cracks are often observed near by the interface. This
paper focuses on the mechanical origin of the embrittlement. The main
causes are: - residual stresses due to the mismatch in the mechanical
properties of the materials to be joined - friction of metal on the ce
ramic surface at the interface during bonding - decrease of the toughn
ess of the ceramic close to the interface consecutively to the diffusi
on of the metallic specie into the ceramic.