Rm. German et al., POWDER-METALLURGY PROCESSING OF THERMAL MANAGEMENT MATERIALS FOR MICROELECTRONIC APPLICATIONS, International journal of powder metallurgy, 30(2), 1994, pp. 205-214
Thermal management materials are needed to dissipate heat associated w
ith high performance microelectronic circuits. Challenges arise both w
ith the material selection and the component fabrication. Powder metal
lurgy techniques provide a means of fabricating high quality composite
systems with tailored thermal properties. Mathematical analysis has i
dentified several candidate P/M materials, many already familiar to th
e P/M community, including W-Cu and SiC-Al. In the near term, W-Cu is
a viable heat sink and packaging material while SiC-Al will be the pri
mary composite for avionic applications. However, major opportunities
are apparent in systems such as AIN-Cu and SiC-Cu, but these will requ
ire novel fabrication routes. This presentation outlines the design of
thermal management materials, identifies the possible property combin
ations, and isolates processing options for some target applications.