It has been reported previously that the mechanism for the erosion-cor
rosion of copper (Cu) in seawater is the removal of protective layers
by hydrodynamic shear. This hypothesis was tested by studying the anod
ic dissolution of Cu in aerated 3.5 wt% sodium chloride (NaCl) solutio
ns using a system designed to isolate the effect of surface shear stre
ss. The experimental apparatus consisted of an axisymmetric impinging
jet and disk electrode coupled with a scanning ellipsometer. This allo
wed a phenomenon occurring at a critical shear stress, such as removal
of protective films, to be seen at a corresponding radial position. E
nhancement of the corrosion rate, as measured electrochemically, was l
ess than would have been caused by an increase in overall convective t
ransport. The ellipsometer did not indicate the presence of any critic
al radius, even though the shear stress at the Cu electrode was an ord
er of magnitude higher than the critical shear stress reported in the
literature. Therefore, the critical shear stress previously reported i
n the literature could not be attributed to removal of protective laye
rs by hydrodynamic shear.