H. Tvardauskas et al., MICROSTRUCTURE AND COMPOSITION OF AN ANODICALLY ETCHED (111) SI SURFACE, Semiconductor science and technology, 9(9), 1994, pp. 1633-1636
Scanning electron microscopy, transmission electron microscopy and x-r
ay photoelectron spectroscopy data for the topmost part of an anodical
ly etched (111) p-Si wafer exhibiting bright visible photoluminescence
have been analysed with regard to microstructure and chemical composi
tion. It is concluded that this region consists of two layers. The fir
st topmost layer contains six compounds: Si-[O2H2], SiO2, SiO, Si6O3H6
, Si and SiH. In this layer the silicon species depth profile and temp
erature dependence were investigated. We find that Si-[O2H2] and SiH d
ecomposed completely at 650 K and at 730 K respectively. The amount of
siloxene is independent of temperature up to 650 K and then begins to
decrease. This was accomplished with desorption of hydrogen from Si6O
3H6 surface species and irreversible oxidation of the samples.