The effect of electrochemical modifications like anodic oxidation, pol
ymer deposition and electrodeposition of Cu and Ni on porous silicon a
re investigated with XPS and sputter depth profiling. It is shown that
after the anodic oxidation small amounts of Si0 remain in the porous
layer. The deposition of polymers as well as of metals takes place not
only at the surface, but also in the porous layer.