S. Simson et al., SURFACE ANALYTICAL INVESTIGATIONS OF AL AND (TI, AL) NITRIDES FORMED BY ION-IMPLANTATION AND THEIR CORROSION PROPERTIES, Surface and interface analysis, 22(1-12), 1994, pp. 431-435
Nitrides of Ti, Al and TiAl(x) alloys were prepared by low energy ion
implantation (3 keV N2+). The layer thickness was approximately 10 nm.
The nitride layers were characterized using XPS, UPS and a Kelvin pro
be. The insulating properties known for bulk AIN were found also for t
he prepared AIN(impl) layers. The work functions for the alloys and th
e nitrides and their variation with the ion dose were determined. Peak
parameters for the XP spectra deconvolution were established. Despite
their thinness, the layers showed anodic stability in 0.5 M H2SO4 up
to 1.3 V (SHE) for (TiAl)N(impl) and even up to 1.8 V (SHE) for AIN(im
pl). Above these potentials, the nitrides were oxidized to metal oxide
s.