PLASTIC PACKAGED MICROCIRCUITS - QUALITY, RELIABILITY, AND COST ISSUES

Authors
PECHT MG AGARWAL R QUEARRY D
Citation
Mg. Pecht et al., PLASTIC PACKAGED MICROCIRCUITS - QUALITY, RELIABILITY, AND COST ISSUES, IEEE transactions on reliability, 42(4), 1993, pp. 513-517
Citations number
18
Categorie Soggetti
Computer Sciences","Engineering, Eletrical & Electronic","Computer Science Hardware & Architecture","Computer Science Software Graphycs Programming
Journal title
IEEE transactions on reliability → ACNP
ISSN journal
00189529
Volume
42
Issue
4
Year of publication
1993
Pages
513 - 517
Database
ISI
SICI code
0018-9529(1993)42:4<513:PPM-QR>2.0.ZU;2-P
Abstract
Plastic encapsulated microcircuits (PEMs) find their main application in commercial and telecommunication electronics. The advantages of PEM s in cost, size, weight, performance, and market lead-time, have attra cted 97% of the market share of worldwide microcircuit sales. However, PEMs have always been resisted in US Government and military applicat ions due to the perception that PEM reliability is low. This paper sur veys plastic packaging with respect to the issues of reliability, mark et lead-time, performance, cost, and weight as a means to guide part-s election and system-design.