The vertical thermal conductivities of thermally grown (TG) and chemic
al vapor deposited (CVD) silicon-dioxide layers 20 to 200 nm thick are
measured using a simple, noncontact photothermal technique. The condu
ctivities of TF and CVD layers are less by as much as 18% and 30%, res
pectively, than the conductivity of bulk fused silicon dioxide. No sig
nificant thickness dependence is observed. The thermal boundary resist
ance between the oxide layers and silicon is shown to be negligibly sm
all. The boundary resistance of gold layers sputtered directly onto TG
oxide is considerably larger than that of gold layers evaporated on T
G oxide with a 20-nm chromium adhesion layer, and is comparable to int
ernal resistances of the oxide layers.