We present and discuss a novel dopant control technique for compound s
emiconductors, called site-competition epitaxy, which enables a much w
ider range of reproducible doping control and affords much higher and
lower epilayer doping concentrations than was previously possible. Sit
e-competition epitaxy is presented for the chemical vapor deposition o
f 6H-SiC epilayers on commercially available (0001)SiC silicon-face su
bstrates. Results from utilizing site-competition epitaxy include the
production of degenerately doped SiC epilayers for ohmic-as-deposited
(i.e., unannealed) metal contacts as well as very low doped epilayers
for electronic devices exhibiting SiC record-breaking reverse voltages
of 300 and 2000 V for 3C- and 6H-SiC p-n junction diodes, respectivel
y.