HIGH-TEMPERATURE ACTIVE OXIDATION AND ACTIVE-TO-PASSIVE TRANSITION OFCHEMICALLY VAPOR-DEPOSITED SILICON-NITRIDE IN N-2 O-2 AND AR O-2 ATMOSPHERES

Citation
T. Narushima et al., HIGH-TEMPERATURE ACTIVE OXIDATION AND ACTIVE-TO-PASSIVE TRANSITION OFCHEMICALLY VAPOR-DEPOSITED SILICON-NITRIDE IN N-2 O-2 AND AR O-2 ATMOSPHERES, Journal of the American Ceramic Society, 77(9), 1994, pp. 2369-2375
Citations number
25
Categorie Soggetti
Material Science, Ceramics
ISSN journal
00027820
Volume
77
Issue
9
Year of publication
1994
Pages
2369 - 2375
Database
ISI
SICI code
0002-7820(1994)77:9<2369:HAOAAT>2.0.ZU;2-T
Abstract
The oxidation behavior of chemically vapor-deposited silicon nitride i n N-2-O-2 acid Ar-O-2 atmospheres was studied using a thermogravimetri c technique at temperatures 1823 to 1923 K. Active oxidation was obser ved at low oxygen partial pressures. The active oxidation rates increa sed with increasing oxygen partial pressure (P-O2) up to a certain P-O 2 and then passive oxidation occurred. The transition oxygen partial p ressures from active to passive oxidation were determined. The rate-co ntrolling step for the active oxidation could be oxygen diffusion thro ugh a gaseous boundary layer near the S3N4 surface. Decomposition of S I3N4 does not seem to be associated with the mass loss behavior. The W agner model was employed to explain the oxidation behavior.