M. Li et al., X-RAY-SCATTERING FROM A ROUGH-SURFACE AND DAMAGED LAYER OF POLISHED WAFERS, Journal of physics. D, Applied physics, 27(9), 1994, pp. 1929-1932
Theoretical and experimental investigations were performed to show the
application of x-ray crystal truncation rod scattering combined with
x-ray reflectivity in the measurements of surface roughness and near-s
urface damage of mechanochemically polished wafers. By fitting the mea
sured crystal truncation rod curves it has been shown that polished wa
fers are divided into three parts -irregular steps on the surface, a d
amaged thin layer beneath the surface and a perfect bulk. The results
show that the root mean square of the surface roughness of mechanochem
ically polished Fe-doped and/or S-doped InP wafers is one to two atom
layers, and that the lateral correlation length of the surface roughne
ss is about 3000-7500 Angstrom. The thickness of the damaged region is
found to be about 1000 atom layers.