SILICIDE FORMATION IN THE CO-SI SYSTEM BY RAPID THERMAL ANNEALING

Citation
J. Pelleg et al., SILICIDE FORMATION IN THE CO-SI SYSTEM BY RAPID THERMAL ANNEALING, Thin solid films, 249(1), 1994, pp. 126-131
Citations number
21
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
249
Issue
1
Year of publication
1994
Pages
126 - 131
Database
ISI
SICI code
0040-6090(1994)249:1<126:SFITCS>2.0.ZU;2-J
Abstract
Rapid thermal annealing was used to obtain additional information on t he phases of the Co-Si system formed during the silicidation reaction between cobalt thin films and silicon substrates. The phase sequence, their stability and their coexistence were investigated by X-ray diffr action and sheet resistance. At an appropriate temperature all three p hases are likely to coexist for short times, although the most common observation is the sequential formation of Co2Si, CoSi and CoSi2 as re ported earlier. Cursory determination of the activation energy for CoS i2 formation by sheet resistance measurements is 241.1 kJ mol(-1).