EVALUATION OF NEW HIGH-TEMPERATURE BORON SOLID PLANAR DIFFUSION SOURCES THROUGH P-N JUNCTION CHARACTERIZATION

Citation
Dk. Hwang et al., EVALUATION OF NEW HIGH-TEMPERATURE BORON SOLID PLANAR DIFFUSION SOURCES THROUGH P-N JUNCTION CHARACTERIZATION, Thin solid films, 250(1-2), 1994, pp. 16-19
Citations number
14
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
250
Issue
1-2
Year of publication
1994
Pages
16 - 19
Database
ISI
SICI code
0040-6090(1994)250:1-2<16:EONHBS>2.0.ZU;2-D
Abstract
The electrical characterization of p-n diodes fabricated using a newly developed high temperature (greater than or equal to 1100 degrees C) boron diffusion source consisting of a homogenous distribution of 9A1( 2)O(3).2B(2)O(3) in a SiC foam substrate was carried out and results w ere compared with those obtained using commercial sources. Specificall y, current-voltage and open circuit voltage decay measurements were pe rformed. The results obtained indicate that devices fabricated from th e new high temperature source perform satisfactorily, exhibiting chara cteristics that are comparable to the characteristics of devices fabri cated from the established commercial high temperature boron diffusion sources.