INFLUENCE OF THERMAL CYCLE ON RESISTANCE TO FRACTURE UNDER SHEAR LOADING OF ADHESIVE FILMS

Authors
KONATE Y
Citation
Y. Konate, INFLUENCE OF THERMAL CYCLE ON RESISTANCE TO FRACTURE UNDER SHEAR LOADING OF ADHESIVE FILMS, International journal of adhesion and adhesives, 14(3), 1994, pp. 181-184
Citations number
14
Categorie Soggetti
Material Science
Journal title
International journal of adhesion and adhesives → ACNP
ISSN journal
01437496
Volume
14
Issue
3
Year of publication
1994
Pages
181 - 184
Database
ISI
SICI code
0143-7496(1994)14:3<181:IOTCOR>2.0.ZU;2-G
Abstract
Adhesive films on structural assemblies have a mechanical resistance w hich is dependent on many factors, including the nature and form of th e adherends, adherend bonding surface roughness, loading type, adhesiv e nature and the cure schedule of hardening. For a fixed value of cure time, the experimental results shown here indicate the influence of c onstant cure temperature on the adhesive shear strength.