FUNGAL ADHESION

This paper reviews the processes involved in fungal attachment: initia l passive attachment which is reversible (impaction, chemotaxis, entra pment, spore appendage mediated attachment); active attachment resulti ng from a thigmotropic response and leading to the production and rele ase of extracellular adhesive; spore differentiation; germination with germ-tubes enveloped by a hyphal sheath; development of appressoria; and, finally penetration of the substratum/host. The chemical composit ion and origin of fungal adhesives is discussed and compared with othe r micro-organisms. Methods to determine the strength of attachment of fungal propagules to surfaces are reviewed and factors affecting funga l adhesion considered. The relevance of spore attachment in biotechnol ogy, biodeterioration of materials, plant and animal pathology are str essed. Future areas of research are highlighted, especially the mechan ism for transmitting a signal that the spore has made contact with the surface, resulting in the production and release of adhesive.