VAPOR-DEPOSITION POLYMERIZATION OF N-METHYLOLACRYLAMIDE

Citation
M. Tamada et al., VAPOR-DEPOSITION POLYMERIZATION OF N-METHYLOLACRYLAMIDE, Thin solid films, 251(1), 1994, pp. 36-39
Citations number
11
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
251
Issue
1
Year of publication
1994
Pages
36 - 39
Database
ISI
SICI code
0040-6090(1994)251:1<36:VPON>2.0.ZU;2-S
Abstract
The thin polymer film of N-methylolacrylamide was obtained with vapor deposition polymerization based on the technique which combined physic al vapor deposition with thermal chemical vapor deposition. The deposi tion rates increased with increments of the filament temperature under the condition of constant crucible temperature. The deposition rate a t the filament temperature of 2300 K was independent of the electric f ield supplied for deposition. In the case of coevaporation with hydroq uinone, the rise of filament temperature was ineffective on the deposi tion rate. The maxima of polymer yield and molecular weight (M(W)) wer e 52% and 2.1 x 10(4), respectively at the filament temperature of 230 0 K. The three factors of polymer yield, M(W) and the number of polyme rs increased concomitantly.