Up to now, no technique is available to allow non-destructive, in situ
, characterization of the polymerization during the curing of a thermo
set resin. Dynamic dielectric measurements made over a wide range of f
requencies would have the potential to provide a sensitive and conveni
ent control of follow-up of both imidization and cross-linking of PMR-
15 resin. This dynamical study is based on dielectric analysis of two
model compounds NE-MDA-NE and 3MDA-2BTDE. A new experimental method is
described to follow up PMR-15 polymerization by using de measurements
. Dynamic mechanical analysis using the same cure cycles as dielectrom
etric measurements were also carried out. Electric and mechanical meas
urements were correlated and the results on the model compounds extend
ed to the analysis of PMR-15 resin present good agreement of the varia
tions of ionic conductivity with mechanical modulus during cure. Based
on these results, cure monitoring of PMR-15 prepreg is possible by us
ing microdielectrometry; in particular, dielectric events can be corre
lated to mechanical phenomena.