LOW-TEMPERATURE SI CRYSTAL-GROWTH BY ALTERNATING DEPOSITION AND HYDROGEN ETCHING SEQUENCES AND ITS APPLICATION TO THE P-LAYER OF A-SI-H SOLAR-CELLS

Citation
K. Yamamoto et al., LOW-TEMPERATURE SI CRYSTAL-GROWTH BY ALTERNATING DEPOSITION AND HYDROGEN ETCHING SEQUENCES AND ITS APPLICATION TO THE P-LAYER OF A-SI-H SOLAR-CELLS, Solar energy materials and solar cells, 34(1-4), 1994, pp. 501-508
Citations number
3
Categorie Soggetti
Energy & Fuels","Material Science
ISSN journal
09270248
Volume
34
Issue
1-4
Year of publication
1994
Pages
501 - 508
Database
ISI
SICI code
0927-0248(1994)34:1-4<501:LSCBAD>2.0.ZU;2-K
Abstract
Low temperature silicon crystal growth by alternating deposition and h ydrogen etching sequences has been studied. The large area remote ECR H-2 plasma was used as an atomic hydrogen source. Epitaxial, polycryst alline, and microcrystalline Si thin films have been obtained below 40 0 degrees C corresponding to various deposition conditions and kinds o f substrates. Epitaxial films with electron mobilities exceeding 800 c m(2)/Vs were obtained on Si(100) substrates. By applying this method, very thin p-type microcrystalline Si films have been prepared on SnO2 substrates below 200 degrees C. The cross-sectional TEM micrographs sh owed that the longitudinal crystal size of microcrystalline on SnO2 su bstrates was about 100-200 Angstrom. The a-Si:H solar cells with p-typ e microcrystalline Si had a higher open-circuit voltage than that of c onventional cells by as much as 0.02-0.04 eV.