Internal-friction and modulus measurements were made on 99.999% pure A
l samples of stabilized grain structure and on the samples covered by
a Cu or Zn layer produced by electrodeposition. These layered samples
were heat treated in order to cause diffusion of the foreign atoms int
o the Al mainly along the grain boundaries. The usual grain boundary r
elaxation was decreased or suppressed by the foreign atoms but the Cu
turned out to be more effective in this sense. For sufficiently thick
Zn layers, even a new relaxational peak appeared. The essential role o
f the grain boundary dislocations can be concluded from the unusual is
othermal results observed in the grain boundary relaxation temperature
range, and from the amplitude dependence of the layered samples after
heat treatment. The role of the covering Zn or Cu layer in the dynami
c recrystallization under axial stress was also investigated.