The gated BJT structure is inherently suitable for SOI BiCMOS technolo
gy. However, being a surface channel device, it suffers higher noise a
nd degraded carrier transport. Ln this study, a novel shallow buried c
hannel design on TFSOI is proposed. Devices with various geometries ha
ve been fabricated with a simple CMOS-compatible process. These device
s have low turn-on voltage, ideal BJT I-V characteristics with current
gain higher than 1000, and a maximum transconductance of 290 mS/mm fo
r a 0.5 mu m channel length and 15 nm gate oxide. Careful measurements
show that an or der of magnitude improvement in noise performance can
be expected from the buried channel operation. These devices are suit
able for various BiCMOS applications.