Rapid isothermal processing (RIP) based on incoherent radiation as a s
ource of optical and thermal energy is emerging as a key low thermal b
udget technique for the processing of semiconductor devices and circui
ts. The continuing development of RIP technique for the fabrication of
electronic and optical devices requires a microscopic understanding o
f various phenomena associated with RIP. Junction formation by diffusi
on process is an integral part of all semiconductor devices. In this l
etter, we have shown that for identical thermal budget, different valu
es of sheet resistivity are observed when the samples are irradiated f
rom front or back. These results cannot be explained by the various pr
ocess models and computer aided design tools available in the literatu
re. We have offered a qualitative explanation of the observed results
based on the role of photoeffects in RIP. The availability of high-ene
rgy photons in the front irradiation configuration and consequent elec
tronic excitation can lead to higher diffusion coefficients as well as
higher activation of dopants, compared to the back irradiated case. (
C) 1994 American Institute of Physics.