J. Park et Bm. Kwak, FORMULATION OF THERMOMECHANICAL FRICTIONAL CONTACT BASED ON COMPLEMENTARITY RELATIONS, International journal of solids and structures, 31(23), 1994, pp. 3217-3231
Citations number
18
Categorie Soggetti
Construcion & Building Technology","Engineering, Civil
On the basis of a linear complementarity, a mathematical formulation o
f thermomechanical frictional contact is presented. Depending on the s
tatus of contact, either a conduction condition or an insulation condi
tion is applied. A complementarity condition between heal flow and tem
perature difference along the contact surface is found assuming that n
o thermal contact resistance exists. This thermal complementarity cond
ition is implicitly related with the mechanical one. The resulting lin
ear complementarity with additional constraints is solved by a modifie
d Lemke's algorithm. Two numerical examples are presented to illustrat
e the procedure and solution behaviors.