FORMULATION OF THERMOMECHANICAL FRICTIONAL CONTACT BASED ON COMPLEMENTARITY RELATIONS

Authors
Citation
J. Park et Bm. Kwak, FORMULATION OF THERMOMECHANICAL FRICTIONAL CONTACT BASED ON COMPLEMENTARITY RELATIONS, International journal of solids and structures, 31(23), 1994, pp. 3217-3231
Citations number
18
Categorie Soggetti
Construcion & Building Technology","Engineering, Civil
ISSN journal
00207683
Volume
31
Issue
23
Year of publication
1994
Pages
3217 - 3231
Database
ISI
SICI code
0020-7683(1994)31:23<3217:FOTFCB>2.0.ZU;2-6
Abstract
On the basis of a linear complementarity, a mathematical formulation o f thermomechanical frictional contact is presented. Depending on the s tatus of contact, either a conduction condition or an insulation condi tion is applied. A complementarity condition between heal flow and tem perature difference along the contact surface is found assuming that n o thermal contact resistance exists. This thermal complementarity cond ition is implicitly related with the mechanical one. The resulting lin ear complementarity with additional constraints is solved by a modifie d Lemke's algorithm. Two numerical examples are presented to illustrat e the procedure and solution behaviors.