Mf. Bartholomeusz et Ja. Wert, THE EFFECT OF THERMAL EXPOSURE ON MICROSTRUCTURAL STABILITY AND CREEPRESISTANCE OF A 2-PHASE TIAL TI3AL LAMELLAR ALLOY/, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 25(11), 1994, pp. 2371-2381
During annealing of a two-phase TiAl/Ti3Al lamellar alloy at 1273 and
1323 K, the lamellar microstructure evolves into a course, globular mi
crostructure. For short annealing times (less than about 1000 hours),
microstructural evolution occurs predominantly by intrapacket terminat
ion migration coarsening. For longer annealing times, cylinderization
and conventional Ostwald ripening coarsening mechanisms are observed.
The activation energy for the rate-controlling diffusion process gover
ning intrapacket termination migration coarsening of the lamellar micr
ostructure was determined to be 215 kJ/mol. Compression creep tests re
veal that the minimum creep rate and primary creep strain of the lamel
lar alloy increase with increasing prior annealing time. Furthermore,
in contrast to the lamellar microstructure, the globular microstructur
e is not susceptible to deformation-induced spheroidization during com
pression creep testing. Modeling demonstrates that the increase of the
minimum creep rate and primary creep strain as a consequence of annea
ling of the lamellar alloy can be accounted for by consideration of tw
o factors: the decrease in the work-hardening rate of the lamellar all
oy in response to the overall decrease in interphase interfacial area
and the decreased mechanical strengthening effect associated with tran
sformation from a lamellar to a globular microstructure.