THE EFFECTS OF DESCALING TREATMENTS ON INTERMETALLIC FORMATION AND THERMOMECHANICAL STABILITY OF AN ELECTROPLATED TIN LEAD LAYER IN A SEMICONDUCTOR LEADFRAME ALLOY/
Ty. Chung et al., THE EFFECTS OF DESCALING TREATMENTS ON INTERMETALLIC FORMATION AND THERMOMECHANICAL STABILITY OF AN ELECTROPLATED TIN LEAD LAYER IN A SEMICONDUCTOR LEADFRAME ALLOY/, Journal of materials science letters, 13(20), 1994, pp. 1465-1468