NOVEL TECHNIQUE OF LASER THROUGH-HOLE DRILLING IN TEFLON

A novel technique of laser drilling of reinforced Teflon films with Si O2 particles is demonstrated. The new process consists of three simple steps. First, 300 Angstrom of gold is deposited on Teflon to allow la ser absorption. Second, drilling is done by pulsed irradiation at a ra te of one here per pulse. At this stage the Teflon is only modified by the laser irradiation. Third, the modified Teflon is removed by ultra sonic cleaning, leaving behind clean through-holes of 50 mu m in diame ter. A potential drilling speed as high as 60000 holes/min with fairly high spatial resolution is the main attraction of this simple techniq ue.